BISMALEIMIDE TRIAZINE RESIN (BT RESIN) - Manufacturing Plant, Detailed Project Report, Profile, Business Plan, Industry Trends, Market Research, Survey, Manufacturing Process, Machinery, Raw Materials, Feasibility Study, Investment Opportunities
PROJECT DESCRIPTION
PRODUCT PROFILE:
BT-Epoxy belongs to the group of thermoset resins used in printed circuit boards (PCBs). It is a mixture of epoxy resin, a common raw material for PCBs and BT resins. This is in turn a mixture of Bismaleimide, which as such is also used as a raw material for PCBs and Cyanate Ester. Three cyano groups of the cyanate ester are trimerized to a triazinering structure, hence the T in the name. In presence of a bismaleimide the double bond of the maleimide group can copolymerize with the cyano groups to heterocyclic 6 membered aromatic ring structures with two nitrogen atoms (pyrimidines). The cure reaction occurs at temperatures up to 250 degrees C, and is catalyzed by strongly basic molecules like Dabco (diazabicyclooctane) and 4-DMAP (4 dimethylaminopyridin). Products with very high glass transition temperatures (Tg) up to 300 degrees C - and very low dielectric constant can be obtained. These properties make these materials very attractive for use in PCBs.
Product characteristics:
BT / Epoxy possess characteristics that make it an excellent selection for larger panel sizes. Advantages such as a high Tg, low coefficient of thermal expansion and excellent electrical insulation in high humidity and at higher temperatures make this to be a good material choice. The enhanced heat resistance of BT resins comes from their ring structure rather than increasing the density of cross links. This means that they have relatively good bond strength and are less brittle than epoxies. It was found that the BT/ Si3N4 composites showed increase in thermal conductivity with Si3N4 weight fraction. The thermal conductivity of the BT/Si3N4 composites was up to 0.94 W/m.K, for a mixture containing 50 wt% of micro Si3N4 fillers in the BT resins matrix, which was about 5 times larger than the pure BT resin. Moreover, the BT/Si3N4 composites had excellent thermal properties. BT resin has become the preferred laminate material for many manufacturers because of its high Tg, low dielectric constant and good insulation properties.
Applications of Bismaleimide triazine resin:
BT resins having various processing temperature conditions can be formulated, which, after polymerizing and crosslinking, can provide materials with various thermal stability, dielectric constants, and mechanical properties for various applications:-
• BT resin is the 'glue' that holds together the glass yarn fibers.
• BT resin is used to make substrates that connect chips used in handsets to printed circuit boards, integrated circuits for smart phones, tablet PCs, feature phones, and networking devices.
• The proportions in the BT resins are varied to produce different properties: a resin with 10% bismaleimide by weight is used for general purpose printed circuit boards, as it has a similar curing temperature to epoxy resins.
• BT is also used to hold the chip dies in place on the packaging substrate material.
GLOBAL SCENARIO:
BT resin has become the preferred laminate material for many manufacturers because of its high Tg, low dielectric constant and good insulation properties. In fact, BT is now apparently the standard substrate material for BGA's, and is also being used in CSP laminates. Japan accounts for an estimated 90% of worldwide output of the product and MGC alone accounts for 50%. PC Mitsubishi Gas Chemical and Hitachi Chemical, boasting 90% global market share.
| Plant capacity |
Plant & machinery |
Working capital |
Cost of Project |
T.C.I |
Return |
Break even |
| - |
- |
- |
0 |
- |
1.00 |
0.00 |
